IEEE

Silicon Dioxide Ring Innovations in TSV Structures: Analysis of Thermal-Mechanical and Signal Integrity for 3-D Chip Applications

Abstract: Through-silicon via (TSV) as a crucial interconnection microstructure in three-dimensional (3D) chip, have significantly enhanced device performance and reliability. However, the increasing ...
IEEE

Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures

Three-dimensional (3D) packaging technology is currently considered the preferred solution beyond Moore’s law, while the through silicon via (TSV) technology is the core of 3D packaging technology.
SciTech Daily

This Tiny Plant Could Help Crops Turn Sunlight Into Food Faster

Scientists have uncovered an unexpected strategy used by hornworts, a rare type of land plant, that could one day help crops grow more efficiently. Credit: SciTechDaily.com A tiny plant’s molecular ...
C&EN

Electrical Response of Poly(N-[3-(dimethylamino)Propyl] Methacrylamide) to CO 2 at a Long Exposure Period

School of Chemical and Biomolecular Engineering, The University of Sydney, Sydney, NSW 2006, Australia The University of Sydney, Sydney Nano Institute, NSW 2006, Australia ...