Hybrid bonding—a significant advancement in chip packaging technology—is becoming vital in heterogeneous integration, which enables semiconductor companies to merge multiple chiplets with diverse ...

A new technical paper titled “Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review” was published by researchers at ...

Traditional ultrasonic imaging systems usually transmit broadband ultrasonic pulses through the full sample volume under study. By analyzing these pulses, researchers can measure sample thickness, ...

The capability of acoustic microscopes to image and analyze internal features, including structural defects, recently has been enhanced by technology that puts any number of acoustic microscopes in ...